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Scope and Topics
Background and Aims
The Japanese Society for Experimental Mechanics (JSEM) was founded in 2001 by reorganizing the former Japan Society for Photoelasticity to extend its covering area of Experimental Mechanics not only to Solid Mechanics but also to various areas of Applied Mechanics such as Fluid Mechanics, Thermal Engineering, Medical Engineering, Biomechanics, Construction and Civil Engineering and so on. The first Symposium was successfully held in Sapporo, Japan (2006) to attain its main purpose of the new establishment. The Symposium was subsequently held in Osaka, Japan (2007), Tainan,Taiwan (2008) and Niigata, Japan(2009).
The present Symposium aims to promote an exchange of recent and advanced information among scientists and engineers in the wide field of Experimental Mechanics with special focus on Environmental, Medical and Welfare Engineering. The Symposium is also aimed particularly at promoting communication and collaboration between fundamental researchers and those engaged in the development of practical technology in respective areas of Experimental Mechanics. This Symposium title was updated to The International Symposium on Advanced Science and Technology in Experimental Mechanics, because the areas covered in the Symposium have been expanded as mentioned above.
Topics of Interest
We welcome papers in the following areas:
- Fundamentals
- Fluid Dynamics
- Multiphase Flow
- Thermodynamics
- Heat and Mass Transfer
- Solid Mechanics / Strength of Materials
- Materials Science and Engineering
- Bioengineering
- Civil Engineering
- Sound and Vibration
- Instrumentation and Testing
- Visualization and Image Processing, and others
- Applications
- Fluid Machinery
- Fluid Flow in Micro- and Nano-scales
- Environmental Science and Engineering
- Advanced Energy and Power Systems
- Combustion Technology
- Medical and Welfare Engineering
- Biomechanics and Biomaterials
- Material Processing
- Materials Testing and Fracture Mechanics Evaluation
- Non-destructive Testing and Inspection
- Optical Methods, Thermal Methods and X-ray Techniques
- Transducer and Sensor Design
- Safety Engineering, Risk Analysis and Reliability Methods
- Smart Materials and Structural Health Monitoring
- MEMS and NEMS
- Recycling
- Electronic Packaging,
- Prosthetics and Orthotics, and others
Technical Exhibition
The Symposium will make plans to exhibit current technologies for instrumentation, diagnosis and products developed by companies, corporations and universities. In addition, it will make plans to provide technical school and college students with an opportunity to present scientific and technological results in poster forms.
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