Background and Aims

The Japanese Society for Experimental Mechanics (JSEM) was founded in 2001 by reorganizing the former Japan Society for Photoelasticity to extend its covering area of Experimental Mechanics not only to Solid Mechanics with focus on Strength of Materials but also to various areas of Applied Mechanics such as Fluid Mechanics, Thermal Engineering, Medical Engineering, Biomechanics, Construction and Civil Engineering and so on. In addition, this new international symposium was organized in order to develop the activity of JSEM in 2005.
The Symposium aims to promote an exchange of recent and advanced information among scientists and engineers in the wide area of Experimental Mechanics. The Symposium is also aimed particularly at promoting communication and collaboration between fundamental researchers and those engaged in the development of practical technology in respective areas of Experimental Mechanics.
The first Symposium was held in Sapporo in 2006 to attain its main purpose of the new establishment. The 2nd Symposium was successfully held in Osaka in 2007. The 3rd Symposium will be held in Tainan in 2008. In addition, two special issues of Journal of JSEM for selected papers in 1st and 2nd Symposiums have been published in 2007 and 2008, respectively.

Topics

Contributed papers are welcome in the following areas:

1. Fundamentals
   1. Fluid Engineering
   2. Multiphase Flow
   3. Heat and Mass Transfer
   4. Fluid Instrumentation
   5. Flow Visualization and Image Processing
   6. Transport Phenomena on Material Processing
   7. Materials Testing and Evaluation
   8. Non-destructive Testing and Inspection
   9. Optical Methods and Image Processing Techniques in Solid Mechanics
   10. Thermal Methods and X-ray Techniques, and others
   
   
2. Applications
   1. Fluid Machinery
   2. Fluid Flow in Micro and Nano-scales
   3. Biomechanics and Clinical Engineering
   4. Biological Systems and Materials
   5. Hostile Environment Applications
   6. Industrial Applications (Automotive, Railway, Energy Plants, etc.)
   7. Transducer and Sensor Design
   8. Smart Materials and Structural Health Monitoring
   9. MEMS and Nanotechnology
   10. Electronic Packaging and others

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